RhinoMaster
11-08-2006, 04:55 AM
IBM's Zurich Research Lab has announced a technology that it says imitates nature and increases the cooling properties of otherwise regular heatsinks by an impressive twofold.
One of the major challenges with cooling processors is designing effective units that can dissipate the heat, either through convection with heatsinks -- passively or forced with fans -- or through alternatives such as water cooling and thermoelectric Peltier systems.
The other challenge that is equally important is heat transference. This is often overlooked, however, as it's difficult to improve upon with current processor heat-spreader designs. That is, efficiently moving the heat from the metal plate on top of the processor -- the heat-spreader -- over to the heatsink or whatever is cooling said chip, is quite challenging.
Rest of the article here!
http://apcmag.com/node/4301
One of the major challenges with cooling processors is designing effective units that can dissipate the heat, either through convection with heatsinks -- passively or forced with fans -- or through alternatives such as water cooling and thermoelectric Peltier systems.
The other challenge that is equally important is heat transference. This is often overlooked, however, as it's difficult to improve upon with current processor heat-spreader designs. That is, efficiently moving the heat from the metal plate on top of the processor -- the heat-spreader -- over to the heatsink or whatever is cooling said chip, is quite challenging.
Rest of the article here!
http://apcmag.com/node/4301