Kougar
06-02-2006, 05:52 AM
AMD Announces More K8L Details (http://www.dailytech.com/article.aspx?newsid=2637)
K8L details continue to pour in at AMD's Technology Analyst Day
Additionally, Hester revealed some more information about the cache specifics on K8L. Each K8L core will have 64KB of dedicated L1 cache, followed by 512KB of dedicated L2 cache. The base models of K8L will have 2MB of shared L3 cache, but Hester also went on to claim that adding more L3 cache was in the company’s roadmap. One thing AMD representatives have not particuarly touched on is the cache reduction from 64+64KB (data+instruction) to 32+32KB. AMD employees have assured us this move is logical with the addition of L3 cache.
A major feature of K8L is DICE, or Dynamic Independent Core Engagement. Essentially, the ACPI layer will have the ability to dynamically adjust individual cores and crossbars on the processor. Each processor core will have the ability to enter its own power-state, or p-state, allowing a K8L processor the ability to conserve power when the system does not have enough threads to utilize the other processor cores. Intel’s Core processors have the ability to enter c-states on a per-core basis, but the AMD demonstration showed a quad-core K8L processor dip individual cores into full halt.
http://images.dailytech.com/nimage/1612_large_slide_50.png
AMD Announces 4x4 Enthusiast Platform (http://www.dailytech.com/article.aspx?newsid=2638)
AMD says it plans to release enthusiast focused processors and platforms
AMD announced today during a conference call that a new platform will be created and focused on just for the enthusiast desktop market. AMD has long been driving high-performance features on its Athlon family of processors and according to a number of surveys, most gamers are swaying towards AMD systems rather than Intel systems for gaming, or other application intense applications. Called 4x4, AMD's new platform brings along dual-socket motherboards.
The new 4x4 platform will feature two dual-core chips coupled with a dual-socket capable motherboard. AMD will also be releasing a new enthusiast focused chipset for the market, which is designed to take non-ECC unbuffered DDR memory. The new motherboards will be AM2 based, and take new AM2 FX-62 and higher -- all AM2 Athlon FX processors will have at least two cores.
http://images.dailytech.com/nimage/1616_large_73.png
AMD Promises 45nm Processors By Mid-2008 (http://www.dailytech.com/article.aspx?newsid=2639)
65nm on track, 45nm by mid-2008
AMD is expected to increase production capacity at their Dresden Fab by four times within the next three years. The details revealed in today’s AMD Technology Analysts Day emphasize the previous announcements of upgrades and transformations of Fab 30 (soon to be Fab 38.) and Fab 36. With the increased production capacity of Fab 36 AMD expects production to ramp up to 25,000 wafers per month. As AMD moves away from 200mm wafer production, 300mm wafer production is expected to completely replace 200mm production around Q2’08.
DailyTech previously mentioned Fab 36 would lose its test facilities to make way for greater production capacity but new test facilities will be built in Singapore and Suzhou. In addition a separate, new test facility will also be built in Dresden. AMD's Daryl Ostrander released a bit of a roadmap (right) featuring some of the new details on facility upgrades in the near future.
As far as new fabrication processes go, 65nm qualification is on track with Revision G Brisbane core processors production ready, though the processor will not ship until the end of 2006. Replacing the 65nm SOI fabrication process is a new 45nm SOI process that is expected to be in production around mid-2008. K8L is still being developed as a 65nm platform and expected for its initial release in 2007.
K8L details continue to pour in at AMD's Technology Analyst Day
Additionally, Hester revealed some more information about the cache specifics on K8L. Each K8L core will have 64KB of dedicated L1 cache, followed by 512KB of dedicated L2 cache. The base models of K8L will have 2MB of shared L3 cache, but Hester also went on to claim that adding more L3 cache was in the company’s roadmap. One thing AMD representatives have not particuarly touched on is the cache reduction from 64+64KB (data+instruction) to 32+32KB. AMD employees have assured us this move is logical with the addition of L3 cache.
A major feature of K8L is DICE, or Dynamic Independent Core Engagement. Essentially, the ACPI layer will have the ability to dynamically adjust individual cores and crossbars on the processor. Each processor core will have the ability to enter its own power-state, or p-state, allowing a K8L processor the ability to conserve power when the system does not have enough threads to utilize the other processor cores. Intel’s Core processors have the ability to enter c-states on a per-core basis, but the AMD demonstration showed a quad-core K8L processor dip individual cores into full halt.
http://images.dailytech.com/nimage/1612_large_slide_50.png
AMD Announces 4x4 Enthusiast Platform (http://www.dailytech.com/article.aspx?newsid=2638)
AMD says it plans to release enthusiast focused processors and platforms
AMD announced today during a conference call that a new platform will be created and focused on just for the enthusiast desktop market. AMD has long been driving high-performance features on its Athlon family of processors and according to a number of surveys, most gamers are swaying towards AMD systems rather than Intel systems for gaming, or other application intense applications. Called 4x4, AMD's new platform brings along dual-socket motherboards.
The new 4x4 platform will feature two dual-core chips coupled with a dual-socket capable motherboard. AMD will also be releasing a new enthusiast focused chipset for the market, which is designed to take non-ECC unbuffered DDR memory. The new motherboards will be AM2 based, and take new AM2 FX-62 and higher -- all AM2 Athlon FX processors will have at least two cores.
http://images.dailytech.com/nimage/1616_large_73.png
AMD Promises 45nm Processors By Mid-2008 (http://www.dailytech.com/article.aspx?newsid=2639)
65nm on track, 45nm by mid-2008
AMD is expected to increase production capacity at their Dresden Fab by four times within the next three years. The details revealed in today’s AMD Technology Analysts Day emphasize the previous announcements of upgrades and transformations of Fab 30 (soon to be Fab 38.) and Fab 36. With the increased production capacity of Fab 36 AMD expects production to ramp up to 25,000 wafers per month. As AMD moves away from 200mm wafer production, 300mm wafer production is expected to completely replace 200mm production around Q2’08.
DailyTech previously mentioned Fab 36 would lose its test facilities to make way for greater production capacity but new test facilities will be built in Singapore and Suzhou. In addition a separate, new test facility will also be built in Dresden. AMD's Daryl Ostrander released a bit of a roadmap (right) featuring some of the new details on facility upgrades in the near future.
As far as new fabrication processes go, 65nm qualification is on track with Revision G Brisbane core processors production ready, though the processor will not ship until the end of 2006. Replacing the 65nm SOI fabrication process is a new 45nm SOI process that is expected to be in production around mid-2008. K8L is still being developed as a 65nm platform and expected for its initial release in 2007.