Kougar
06-22-2006, 12:35 AM
There is no life after Conroe... :mrgreen:
I was surprised reading this though, it looks like THG's article written back in December is correct. Intel will have a 45nm Penryn in 2007, and the list continues on further, reaching tri-gate transisters and then passing them... Conroe, to Penryn, to Nehalem, to Nehalem-C, then Gesher...
What's the absolute bleeding edge in Intel CPU design for the next five years? "Penryn," "Nehalem" and "Gesher"
Penryn, which will be based on Intel's lithography process known as P1266, is a 45nm unified core set for launch in 2007 that is also expected to stay into production into 2008. ... Aside from the process shrink on Penryn, the major divergence in design from Conroe is the new material design. With P1266, Intel shifts away from Silicon Dioxide gate dielectrics -- a process the company has used since the mid-90s -- to High-k dielectrics. With new dielectric techniques, the company will also revamp its gate electrodes to metal instead of Polysilicon derivatives. The last major materials change of such magnitude occurred when Intel moved from Silicon to Strained Silicon in 2002, which is still slated for use in P1266 and beyond.
According to Intel's long term roadmap, Penryn will become the last "Core" (NGMA) microarchitecture, but it will not become the last 45nm generation. A new architecture, based on the Nehalem core, will make an appearance in 2008. This Core successor, dubbed by many as NGMA2, will essentially take all of the 45nm manufacturing principles of Penryn and apply them to the totally new Nehalem architecture. This transition will be very similar to the P6+ transition with Yonah from Dothan to Conroe.
Lots more info at http://www.dailytech.com/article.aspx?newsid=2649 (http://www.dailytech.com/article.aspx?newsid=2649)
http://img366.imageshack.us/img366/5313/1775largelongtermroadmap7fs.png
I was surprised reading this though, it looks like THG's article written back in December is correct. Intel will have a 45nm Penryn in 2007, and the list continues on further, reaching tri-gate transisters and then passing them... Conroe, to Penryn, to Nehalem, to Nehalem-C, then Gesher...
What's the absolute bleeding edge in Intel CPU design for the next five years? "Penryn," "Nehalem" and "Gesher"
Penryn, which will be based on Intel's lithography process known as P1266, is a 45nm unified core set for launch in 2007 that is also expected to stay into production into 2008. ... Aside from the process shrink on Penryn, the major divergence in design from Conroe is the new material design. With P1266, Intel shifts away from Silicon Dioxide gate dielectrics -- a process the company has used since the mid-90s -- to High-k dielectrics. With new dielectric techniques, the company will also revamp its gate electrodes to metal instead of Polysilicon derivatives. The last major materials change of such magnitude occurred when Intel moved from Silicon to Strained Silicon in 2002, which is still slated for use in P1266 and beyond.
According to Intel's long term roadmap, Penryn will become the last "Core" (NGMA) microarchitecture, but it will not become the last 45nm generation. A new architecture, based on the Nehalem core, will make an appearance in 2008. This Core successor, dubbed by many as NGMA2, will essentially take all of the 45nm manufacturing principles of Penryn and apply them to the totally new Nehalem architecture. This transition will be very similar to the P6+ transition with Yonah from Dothan to Conroe.
Lots more info at http://www.dailytech.com/article.aspx?newsid=2649 (http://www.dailytech.com/article.aspx?newsid=2649)
http://img366.imageshack.us/img366/5313/1775largelongtermroadmap7fs.png