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werty316
07-27-2006, 06:04 AM
New MMC flash media based on Samsung's 8Gb NAND flash memory modules

Samsung Electronics announced today that it has taken the MMC card to a higher density and higher performance in a product line called MMCplus.

The MMCplus flash memory cards are based on Samsung's 8Gb NAND flash memory that will alow it to hold up to 8GB of data on a single flash card. The 8GB version, along with the 1GB, 2GB, and 4GB cards, will be based on multi-level cell NAND flash.

The MMCplus line will also include a higher performance flash card based on single-level cell NAND which will perform up to 3 times faster than last generation MMC media. The new high-performance MMC cards will feature a 40MBps read speed and a 25MBps write speed and will come in 1GB and 2GB capacities.

Samsung recently made the announcement that it had quadrupled the density of its OneNAND flash memory from 2Gb to 8Gb just last week and has already been working on flash media products. Samsung was able to achieve this high density by using a process it calls "wafer -level stack process" which allows multiple wafers to be stacked together and daisy-chained using silicon interconnects through the wafers. In the case of 8GB NAND flash memory, there are a total of 2 vertically stacked 4GB packages each composed of 4 vertically stacked 8Gb dies.

The MMCplus high capacity and high performance flash media is expected to ship sometime in the second half of 2006, which means before the winter holidays. There has been no word of pricing on the MMCplus media but we will keep you updated once any information has been released.

Article Source: http://www.dailytech.com/article.aspx?newsid=3525

GIBSON
07-27-2006, 09:28 PM
Samsung was able to achieve this high density by using a process it calls "wafer -level stack process" which allows multiple wafers to be stacked together and daisy-chained using silicon interconnects through the wafers. In the case of 8GB NAND flash memory, there are a total of 2 vertically stacked 4GB packages each composed of 4 vertically stacked 8Gb dies
There seems to be something wrong in there IMHO. Shouldn't that be 2 vertically stacked 4GB packages each composed of 4 vertically stacked 1GB dies?