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09-09-2011, 03:24 AM #1RSS_Poster Guest
3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors
The goal is to build a processor that has only been dreamed of till now. Up to 1000 times faster than than the fastest thing out there today. Innovation leading to the creation of ‘Silicon Skyscrapers ST. PAUL, Minn. & ARMONK, N.Y. - 07 Sep 2011: 3M and IBM (NYSE: IBM) today announced that the two companies pla
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