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Heatsinks / Coolers

CoolIT Freezone Elite

Date: 2008-04-25 | Author: Gregg Gonsowski
Company: CoolIT systems

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INTRODUCTION

The art of overclocking has led to many advancements throughout the computer industry. From higher quality components used on motherboards to faster RAM capable of keeping up with the CPU, overclocking is at the very heart of advancement. It is because of overclocking that we have after market coolers that can cope with the extra heat output from CPUs which brings me to the point of this article. There are many different methods for removing heat from your CPU which helps to lengthen the processor's life as well as increasing your overclocking headroom. There are high-end air coolers for the enthusiasts, water-cooling for the hardcore crowd and phase-change cooling for the extreme users. Each of these methods have distinct advantages and disadvantages. While water cooling offers lower temps than air cooling it is often an order of magnitude harder to setup and maintain. The same goes for phase-change cooling over water cooling, which brings us to the Freezone Elite from CoolIT systems. The Freezone Elite promises better cooling than water while being as easy to setup as a high-end air cooler. Trying to be all things to all people is always a risky path to take but one that can prove to be extremely lucrative if implemented properly. Does the Freezone Elite have what it takes to earn a spot in your gaming machine or is it just smoke and mirrors? I intend to find out.

We would like to take a moment and thank the mentally unstable crew at CrazyPC.com for sending us this unit to destroy test.

SPECIFICATIONS

Technical Specs

CPU FHE (Fluid Heat Exchanger)
Design: Monolithic copper, multi-cell
Dimensions: 43 x 42 x 16.5 mm
Weight: 175g  

TCM (Thermal Control Module)
See TCM and MTEC Datasheets for full detailsTCM Options

Basic TCM
Control module that offers basic control functionality.

MTEC Control Center Module
Full featured system status monitor and control module.

Please see MTEC Control Center Data Sheet.

Chiller and Pump Module  

Heatsink

Design: Dual dissipation plate, anodized alloy
Dimensions: 121 x 92 x 65 mm
Weight: 800g
 TECs (6)
Power usage: Max total 72 Watts
Design: Six solid-state heat pump wafers
Dimensions: 40 x 40 x 3.5 mm (each)
Weight: 20g (each)

Chiller FHE’s (2)

Design: Dual anodized alloy distribution, multi-channel
Dimensions: 121 x 41 x 12 mm (each)
Weight: 80g (each)
Fan
Power usage: Max 8 Watts
Airflow: 120 CFM
Noise: Max 40 dBA
Bearing Type: Dual ball
Life Cycle: 50,000 hrs
Dimensions: 120 x 120 x 38mm
Features: 3rd Wire Tachometer

Pump

Power usage: 8W +/- 0.5W
Design: 12VDC coreless outrunner pump with integrated expansion vessel
Noise: <15dBALife Cycle: 50,000 hrs
Dimensions: 50 x 50 x 75 mm
Flow: 3.5 L/minWeight: 205g

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