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OCZ PC3-16000 NVIDIA SLI-Ready Edition

Date: 2008-10-24 | Author: Mark Taliaferro
Company: OCZ

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Things are about to change in desktop memory. DDR3, which has been getting a bad rap from Intel users, is about to bloom into its heyday. DDR3 memory will run on pre-Nehalem series CPU's, but it was really designed with Intel's Nehalem in mind. People who scoffed at DDR3 as not being much better than DDR2 will soon have their noses rubbed in it in a big way.

The limitation with DDR3 hasn't been in the design of DDR3, which in itself is an elegant design that was well planned and well executed, but the bump in the road with DDR3 has always been with the motherboard and CPU limitations placed on it.

OCZ was nice enough to ship us a two Gigabit kit of their OCZ PC3-16000 NVIDIA SLI-Ready Edition DDR3. Scoff if you will, but you need to take heed from those that have had Nehalem in hand. DDR3 is coming of age and it's good. It's really good. It's really fast. And it will be one of the most sought after performance products as soon as the Nehalem flood gates open.

About OCZ:

Entering the memory market in August 2000, OCZ Technology was built around the determination to manufacture the best high speed DDR and RDRAM. OCZ was founded by enthusiasts, for enthusiasts, and our commitment to the end-user has not digressed. OCZ Technology has been an innovator in many areas. We were the first manufacturer to make Dual Channel optimized memory available to the public, which originally took advantage of nVidia's Twinbank or Dual DDR architecture, found in their nForce chipset. We have now taken that technology and tailored it for the Canterwood, and Granite Bay chipset's. OCZ developed and was the first to implement ULN technology, which has been a critical element in our manufacturing process for some time. We at OCZ diligently work to improve communication with CPU and motherboard chipset manufacturers prior to the release of their products. Only in this manner can we fine-tune our memory's SPD settings, ensuring a synergistic relationship between the memory module, memory controller, and microprocessor. In today?s rapidly evolving semiconductor industry, such communication is not simply research, but a necessary component of our manufacturing process.

 


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