Antec Performance CPU Cooler

Effective cooling is an essential element of every computer system. This statement is even more so true for the "Computer Enthusiast" as we have a tendency to try and push the limitations and boundaries of every new piece of equipment that we purchase thus producing more heat and requiring even more effective cooling. Let's face it this premise begins with the CPU as without effective cooling of this "central core" of our system the rest would be somewhat irrelevant. Over the last few years we have seen some rather drastic changes in the design(s) of the CPU heat sinks that have hit the market. Prototypes have been constructed out of almost every material that is known by science to help conduct and quickly dissipate heat. Over time the predominance of materials used has become more focused on that of either Aluminum or Copper, the two best recognized materials to achieve this task.

Of particular interest are the design extremes we have seen hit the market. They range from large to small, heavy to light, all aluminum to all copper and combinations of the two elements. We have also seen thin fins, thick fins, heat pipes, radiators, active cooling, passive cooling, mini air conditioners and mixtures of all of these design types. With the ever increasing power hunger of each new CPU that hits the market comes a myriad of new devices to keep it cool. Is there or for that matter will there ever be a "Holy Grail" when it comes to cooling? Probably not, as long as the technology keeps advancing at its current rate. That alone is what keeps consumer interests peaked and research and development teams employed and running in over drive mode just to keep up.

Today we're going to looking at a brand new HSF, simply called the Performance CPU Cooler, just introduced by Antec® a company well known for design and manufacture of cases, fans, and other quality cooling solutions. While well versed in cooling solutions, and even OEM production of several basic HSFs, to the best of my knowledge this is Antec's first truly "High Performance" HSF to be marketed. Will it meet the mark necessary for success or fall short of the mark as first generation products often due. Join me and we'll find out together.

My first impression of this HSF after removing its clam shell type package from the original shipping container was that it was quite a bit lighter than most of the heat sinks that I had been accustomed to using. The product literature stated that it used both Copper and Aluminum in it's construction, and judging from weight alone it probably uses much more Aluminum than Copper.

Closer visualization showed two heat pipes running both left and right of device's center that appeared to be mostly copper with a number of thin attached Aluminum fins surrounding them. There was also active cooling provided by an 70mm x 15mm side-mounted fan.

The package included the HSF with attached fan, mounting brackets for both Intel and AMD processors, a small tube of Antec's thermal paste, and a folded concise sheet of instructions. Also included are two metal back plates, one for Intel and one for AMD, that attach to the underside of your motherboard for mounting the HSF.